Recently, three national standards for microwave integrated circuits, under the administration of the Ministry of Industry and Information Technology (Electronics) and technical jurisdiction of the National Technical Committee for Integrated Circuits Standardization (TC599), have been officially issued. All three standards adopt IEC international standards identically, establishing unified technical benchmarks aligned with international norms for core microwave integrated circuit devices in China.

Covering three core devices including amplifiers, attenuators and frequency converters, the three standards correspond to our flagship product lines. Among them, the amplifier standard fully replaces the 2007 version with comprehensive upgrades.

As one of the participating organizations, Bonray(Xi'an) Integrated Information Electronics Technology Co., Ltd has provided solid industrial technical support for the formulation of these standards.

High Grade: Benchmarking Global Standards with Full-spectrum Coverage

High grade defines the primary attribute of Bonray Electronics chips. Bonray Electronics specializes in microwave radio frequency monolithic integrated circuits (MMICs) and digital-analog hybrid chips. Adopting GaAs, GaN, CMOS and other processes, our products deliver full coverage from shortwave to millimeter wave bands.

• Broad frequency bandwidth: Full-band layout spanning shortwave to millimeter wave, supporting diverse scenarios within one unified technical framework
• Low power dissipation: Optimized balance between performance and power dissipation to enable system-level integration and long-term stable operation
• High integration: Multiple product lines including small-signal, large-signal, time-frequency, SiP and board-level products
• Complete frequency portfolio: Shortwave, ultra-shortwave, microwave and millimeter wave bands, eliminating the need for multi-vendor coordination

The release of the three national standards delivers authoritative definitions of what constitutes high-grade microwave integrated circuits. Bonray Electronics’ product portfolio keeps pace with these internationally aligned benchmarks.

High Quality: Full-process Controllability, 100% Component Testing

High quality is built through manufacturing rather than merely verified by inspection. From design to delivery, every chip undergoes rigorous validation procedures:

• Design verification: Circuit simulation, layout review and process adaptation to lock performance boundaries at the design stage
• Wafer testing: DC and RF parameter testing for each wafer and die to screen out non-conforming units
• Packaging screening: Strict screening in compliance with GJB standards to identify early failure risks
• Temperature cycling and burn-in: Stability validation under environmental stress including thermal cycling and high-temperature burn-in
• Full-parameter final test: Full-band and full-parameter testing for every single chip with traceable test data
• Full-process quality traceability: Complete quality records archived to enable bidirectional traceability from wafer lots to finished chips

Our production lines are governed strictly by national military standards and national standards, realizing full-process autonomy and controllability covering design, tape-out, packaging and testing. High-grade products stem from our relentless commitment to eliminating any non-conforming components. The company has obtained over 100 authorized patents, undertaken more than 100 national-level core chip development and substitution projects, and been recognized as a National-level Key Specialized and Sophisticated "Little Giant" Enterprise.

High Reliability: Long-term Validation in Real-world Demanding Scenarios

High reliability must be validated under the harshest operating conditions. Bonray Electronics’ high-grade chips have been deployed in volume in key sectors such as national defense and aerospace, and proven reliable under long-duration, continuous and high-intensity operating conditions. These applications impose far stricter requirements on devices regarding wide-temperature adaptability, environmental stress resistance, long-term stability and supply continuity compared with general commercial standards.

Mass engineering applications have refined our reliability design, process windows and quality control systems. Such performance is not merely lab-measured specifications, but proven reliability validated on production lines.

This reliability advantage extends to a broad range of high-end industrial applications:

• Security inspection: High linearity and low noise support spectrum monitoring and wireless video transmission, improving signal recognition accuracy
• Industrial communications: Stable wide-temperature operation to guarantee long-term reliable performance of industrial wireless communications and private network equipment
• Automotive electronics: Meeting stringent automotive-grade requirements for consistency and traceability
• Medical electronics: Low power consumption and high integration enable miniaturization and extended service life of medical devices
• Low-altitude economy: Lightweight RF solutions for UAVs, low-altitude communication and sensing systems
• Commercial aerospace: Stable parameters under wide temperature and high vibration environments for satellite-borne and ground station applications

From national key domains to high-end industrial scenarios, we deliver consistent reliability under unified standards and from the same production lines.

Standards as the Foundation for Advancing Autonomy and Controllability

The release of these three national standards signifies far more than technical documents.

• Unified industry terminology: Standardizing product definitions and test evaluation methods for core microwave integrated circuit devices, aligning specifications across domestic design, manufacturing and inspection links
• Global interoperability: Identical adoption of IEC international standards enables alignment between domestic products and global technical systems, facilitating global market access for domestic chips and smoother introduction of overseas technologies
• Solid application foundation: Reliable basis for product selection and quality evaluation, supporting large-scale adoption of high-grade chips and lowering industrial chain collaboration costs

For Bonray Electronics, participation in national standard formulation is both a validation of our technical accumulation and a starting point for future growth.

Outlook and Commitment

• Deepen technology: Continuous R&D investment in GaN, GaAs, CMOS and other process routes, pursuing breakthroughs in higher frequency bands, greater integration and enhanced reliability
• Optimize standards: In-depth engagement in national and industrial standard system development, translating frontline industrial experience into reusable industry consensus
• Stabilize supply: Maintain a fully autonomous and controllable industrial chain, delivering stable production capacity and rapid delivery to provide reliable support for key customers
• Create tangible value: Upholding our vision of "enabling everyone to access autonomous and controllable high-grade core chips", contributing Bonray’s "chip power" to boost the core competitiveness of China’s electronic information industry

Bonray Electronics consistently adheres to the quality philosophy of high grade, high quality and high reliability. With stricter requirements and stable delivery, we earn customer trust and deliver customer value in high-end application scenarios.

Our Promises

• Peace of mind in selection: Internationally benchmarked product portfolio to support well-informed product selection
• Worry-free operation: Full-process controllable production system to ensure every chip passes rigorous inspection
• Empower customer success: Stable production capacity and rapid response to help customers maintain leading performance in high-end scenarios

Bonray Electronics moves forward alongside the industrial chain, striving to make autonomous and controllable high-grade core chips accessible to all.